2-layer rigid PCB built on Wangling's WL-CT440 high-performance thermosetting resin-based high-frequency laminateil

2-Layer WL-CT440 PCB | 30mil Core | ENIG Finish

Product Overview

We are pleased to present this newly customized 2-layer rigid PCB built on Wangling's WL-CT440 high-performance thermosetting resin-based high-frequency laminate. As part of the WL-CT series, this material features a hydrocarbon resin + ceramic + fiberglass cloth dielectric composition, delivering low-loss performance while enabling standard FR-4 fabrication processes.

The board measures 89mm x 63.5mm (single piece) with a finished thickness of 0.8mm (including 30mil core + 2 x 35μm copper) and dimensional tolerance of ±0.15mm. Minimum trace and space are an impressive 4/6 mils, with a minimum finished hole size of 0.2mm. No blind vias are used in this construction.

This design features no solder mask and no silkscreen on both sides—an intentional choice to eliminate parasitic losses and ensure optimal RF performance. The ENIG (Electroless Nickel Immersion Gold) surface finish provides excellent solderability, flatness for fine-pitch components, and superior corrosion resistance. Every board undergoes 100% electrical testing prior to shipment and conforms to IPC-Class-2 quality standards. Gerber files are supplied in RS-274-X format, and worldwide shipping is available.

PCB General Specifications

Material Advantages: WL-CT440

The WL-CT440 from Taizhou Wangling Insulation Material Factory is a thermosetting resin-based high-frequency material from the WL-CT series. The dielectric layer composition of hydrocarbon resin + ceramic + fiberglass cloth delivers an exceptional balance of electrical and mechanical properties.

Key material highlights:

Thermosetting resin system – offers superior heat resistance and dimensional stability compared to thermoplastic alternatives

FR-4 compatible processing – significantly simpler fabrication than PTFE materials, with better circuit stability and consistency

High Tg (>280°C) – maintains dimensional stability and plated through-hole quality even at elevated temperatures

Low CTE matched to copper (X:14, Y:18 ppm/°C) – excellent dimensional stability and reduced stress in multilayer constructions

Low Z-axis CTE (35 ppm/°C) – ensures reliable plated through-hole quality

High thermal conductivity (0.66 W/m·K) – superior to comparable thermoplastic materials, suitable for higher power applications

Excellent radiation resistance and low outgassing – meets aerospace vacuum requirements

Processing Advantages (vs PTFE):

No specialized via preparation (no sodium etch required)

Compatible with standard FR-4 fabrication equipment

Suitable for multiple lamination cycles – excellent for multilayer, high-layer-count, and backplane applications

Excellent machinability for dense hole patterns and fine-line circuits

Important Note: WL-CT440 is available only with ED copper foil (not RTF). Other WL-CT series models may offer RTF copper options.

WL-CT440 Material Properties

PCB Stackup & Construction

The board features a robust 2-layer stackup:

Top Copper (Layer 1): 1 oz (35μm) – ED copper foil

Dielectric Core: WL-CT440 – 30mil (0.762mm)

Bottom Copper (Layer 2): 1 oz (35μm) – ED copper foil

Total Finished Thickness: 0.8mm

Minimum trace and space are 4/6 mils, with a minimum finished hole size of 0.2mm. Via plating thickness is 20μm, and no blind vias are used. The design supports 37 components, 49 total pads (27 thru-hole, 22 top SMT), 31 vias, and 2 nets.

Both solder mask and silkscreen are omitted on both sides, preserving the bare dielectric surface for optimal RF performance and minimizing signal loss.

Typical Applications

Thanks to its low loss, stable Dk (4.10), FR-4 compatible processing, and high Tg, this PCB is ideally suited for:

• Aerospace equipment – space, cabin equipment, aircraft
• Microwave circuits, antennas, and phase-sensitive antennas
• Early warning radar and airborne radar systems
• Phased array antennas and beam wave networks
• Satellite communication and navigation systems
• Power amplifiers

Available Configurations

WL-CT440 is available with ED copper foil only (0.5 oz or 1 oz). Standard panel sizes include 460×610mm (18"×24") and 915×1220mm (36"×48"). Dielectric thicknesses are available in multiples of 0.254mm (10mil), with 0.762mm (30mil) as used in this design. For applications requiring shielding or enhanced heat dissipation, the WL-CT series can also be supplied with aluminum backing (WL-CT***-AL).

All PCBs are 100% electrically tested and shipped with a Certificate of Conformance per IPC-6012. For Gerber review, stackup confirmation, or volume pricing, please contact our technical sales team.