ultra high DK20 2-Layer rigid TP2000 PCB ceramic-filled polyphenylene oxide (PPO) resin (6.1mm Thick, Bare Copper)

2-Layer TP2000 PCB (6.1mm Thick, Bare Copper)

Overview

This 2-layer rigid PCB is engineered for demanding high-frequency RF and microwave applications. Built on TP2000 – a unique ceramic-filled thermoplastic laminate – the board delivers an exceptional dielectric constant (Dk) of 20 and an ultra-low dissipation factor (Df) of 0.002 at 5GHz. With a finished thickness of 6.1mm and bare copper surfaces, this design prioritizes signal integrity, mechanical rigidity, and high-power handling.

Measuring 85mm × 85mm (±0.15mm), the board is manufactured without solder mask or silkscreen, making it ideal for applications where minimal dielectric absorption and maximum thermal stability are required.

TP2000 Substrate Introduction

TP2000 is a high-performance, high-frequency thermoplastic material developed for compact RF and microwave designs. Unlike conventional PTFE or glass-reinforced laminates, TP2000 uses a ceramic-filled polyphenylene oxide (PPO) resin system with no glass fiber reinforcement.

TP2000 Substrate – Technical Specification Sheet

Key Attributes of TP2000:

High Dielectric Constant (Dk = 20 at 5GHz) – Enables significant size reduction in antennas, filters, and matching networks.

Ultra-Low Dissipation Factor (Df = 0.002 at 5GHz) – Minimizes insertion loss and preserves signal integrity at high frequencies.

Stable Dk over Temperature (TCDk = –55 ppm/°C) – Ensures consistent electrical performance across a wide operating range.

Low and Isotropic CTE (X/Y: 35 ppm/°C, Z: 40 ppm/°C) – Provides excellent dimensional stability and reliable plated through-hole (PTH) reliability.

Wide Operating Temperature (–100°C to +150°C) – Suitable for aerospace, defense, and automotive radar environments.

Excellent Machinability – Supports standard PCB drilling, routing, and engraving processes without special tooling.

UL 94V0 Flammability Rating – Meets safety requirements for electronic equipment.

Radiation Resistant – Performs reliably in satellite and space applications.

TP2000 is an ideal choice for engineers who need to reduce circuit size while maintaining low loss and high thermal stability.

PCB Construction Details

PCB Stackup (2-Layer Rigid)

The symmetrical stackup minimizes warpage, while the thick 6mm TP2000 core provides exceptional mechanical strength and thermal mass for high-power applications.

PCB Statistics (per board)

Why Bare Copper? Why No Mask or Silkscreen?

No solder mask eliminates dielectric loss, phase shift, and parasitic capacitance in sensitive RF paths.

No silkscreen prevents contamination and avoids unwanted thickness variations.

Bare copper offers excellent conductivity and is well-suited for high-power RF, test fixtures, and applications requiring direct soldering or contact.

Note: Bare copper surfaces will oxidize over time when exposed to air. For long-term reliability in non-hermetic environments, consider an optional protective finish (ENIG, immersion silver, or OSP) upon request.

Typical Applications

High-frequency RF and microwave circuits

Antenna systems (including phased array antennas)

Radar systems (automotive, aerospace, defense)

Satellite communication equipment

High-power RF amplifiers

Test and measurement instruments

Aerospace and defense electronics

Ordering & Support

This TP2000 PCB is available worldwide and can be manufactured to IPC Class2 standards. Custom dimensions, thicknesses, and copper weights are available upon request.

For design assistance, impedance control calculations, or volume pricing, please contact our technical sales team.