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F4BM220 DK2.2 PCB 2-layer 0.5mm Thick with Immersion Gold 35um copper weight using in Microwave, RF, and radar systems
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F4BM220 DK2.2 PCB 2-layer 0.5mm Thick with Immersion Gold 35um copper weight using in Microwave, RF, and radar systems
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F4BM220 DK2.2 PCB 2-layer 0.5mm Thick with Immersion Gold 35um copper weight using in Microwave, RF, and radar systems

Nombre De Pièces: 1 pièces
Prix: 0.99-99USD/PCS
Emballage Standard: Emballage
Période De Livraison: 2-10 jours ouvrables
Méthode De Paiement: T / t, paypal
Capacité D'approvisionnement: 10000 pièces
Les informations détaillées
Description du produit
Les informations détaillées
Lieu d'origine
Chine
Nom de marque
Wangling
Certification
ISO9001
Numéro de modèle
F4BMS220
Quantité de commande min:
1 pièces
Prix:
0.99-99USD/PCS
Détails d'emballage:
Emballage
Délai de livraison:
2-10 jours ouvrables
Conditions de paiement:
T / t, paypal
Capacité d'approvisionnement:
10000 pièces
Description du produit

Double-Sided PCB with F4BM220 Core

 

We are excited to unveil our double-sided PCB, designed with the high-performance F4BM220 laminate. This PCB is engineered for microwave, RF, and radar systems, offering exceptional electrical properties, low loss, and dimensional stability. Below, we provide a detailed breakdown of its construction, features, and applications.

 

F4BM220 DK2.2 PCB 2-layer 0.5mm Thick with Immersion Gold 35um copper weight using in Microwave, RF, and radar systems 0

 

PCB Construction Details

Parameter Specification
Base Material F4BM220
Layer Count 2-layer (double-sided)
Board Dimensions 51mm x 67mm ± 0.15mm
Minimum Trace/Space 5/8 mils
Minimum Hole Size 0.3mm
Blind/Buried Vias None
Finished Board Thickness 0.6mm
Copper Weight 1oz (1.4 mils) outer layers
Via Plating Thickness 20μm
Surface Finish Immersion Gold
Top Solder Mask None
Bottom Solder Mask None
Top Silkscreen None
Bottom Silkscreen None
Electrical Testing 100% tested prior to shipment
Quality Standard IPC-Class-2

 

 

PCB Stackup

Layer Material Thickness
Copper Layer 1 Copper Foil 35μm
Core Material F4BM220 Core 0.5mm
Copper Layer 2 Copper Foil 35μm

 

 

PCB Statistics

This PCB is optimized for small-scale, high-performance designs with the following specifications:

Parameter Value
Components 5
Total Pads 19
Thru Hole Pads 11
Top SMT Pads 8
Bottom SMT Pads 0
Vias 17
Nets 2
Supplied Artwork Gerber RS-274-X

 

 

About F4BM220 Material

The F4BM220 laminate, developed by Wangling, is a high-performance material made from fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film. It is designed for microwave and RF applications requiring low dielectric loss, high insulation resistance, and excellent stability.

 

Key Features of F4BM220:

  • Dielectric Constant (Dk): 2.2 ± 0.04 at 10GHz.
  • Dissipation Factor (Df): 0.001 at 10GHz, ensuring minimal signal loss.
  • Thermal Coefficient of Dk: -142 ppm/°C (from -55°C to 150°C).
  • Coefficient of Thermal Expansion (CTE): X-axis: 25 ppm/°C. Y-axis: 34 ppm/°C. Z-axis: 240 ppm/°C.
  • Moisture Absorption: ≤ 0.08%.
  • Flammability: UL-94 V0 rated.

The F4BM220 material offers excellent dimensional stability by balancing the ratio of PTFE and fiberglass cloth, resulting in precise control of the dielectric constant and reduced thermal expansion.

 

 

Applications

Microwave and RF Systems

Phase-Sensitive Antennas and Arrays

Power Dividers, Couplers, and Combiners

Base Station Antennas

Satellite Communications

 

 

Conclusion

The double-sided PCB with F4BM220 core is a high-performance, cost-effective solution for microwave, RF, and radar systems. With its low dielectric loss, dimensional stability, and excellent thermal properties, this PCB delivers exceptional performance for high-frequency applications in industries such as telecommunications, aerospace, and defense.

 

Contact us today to learn more or to place an order. We are committed to providing high-quality PCBs that meet your specific requirements!

 

Les étiquettes: 

carte PCB à grande vitesse,  

conception de circuit à haute fréquence,  

bluetooth circuit board

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produits
DéTAILS DES PRODUITS
Produits

PCB nouvellement expédiée par Bicheng

Panneau de carte PCB de Rogers

Panneau taconique de carte PCB

Panneau de carte PCB de PTFE

circuit imprimé flexible

Panneau multicouche de carte PCB

Carte PCB à hautes températures

Panneau de carte PCB de HDI

L'impédance a commandé la carte PCB

Prototypes de carte PCB

Blog

Panneau de carte PCB d'Arlon

Panneau hybride de carte PCB

Panneau de la carte PCB FR-4

Carte PCB à haute fréquence

PCB de la série F4B

PCB à RF

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F4BM220 DK2.2 PCB 2-layer 0.5mm Thick with Immersion Gold 35um copper weight using in Microwave, RF, and radar systems
  • Nom
  • Nom
  • Nom
F4BM220 DK2.2 PCB 2-layer 0.5mm Thick with Immersion Gold 35um copper weight using in Microwave, RF, and radar systems
Nombre De Pièces: 1 pièces
Prix: 0.99-99USD/PCS
Emballage Standard: Emballage
Période De Livraison: 2-10 jours ouvrables
Méthode De Paiement: T / t, paypal
Capacité D'approvisionnement: 10000 pièces
Les informations détaillées
Description du produit
Les informations détaillées
Lieu d'origine
Chine
Nom de marque
Wangling
Certification
ISO9001
Numéro de modèle
F4BMS220
Quantité de commande min:
1 pièces
Prix:
0.99-99USD/PCS
Détails d'emballage:
Emballage
Délai de livraison:
2-10 jours ouvrables
Conditions de paiement:
T / t, paypal
Capacité d'approvisionnement:
10000 pièces
Description du produit

Double-Sided PCB with F4BM220 Core

 

We are excited to unveil our double-sided PCB, designed with the high-performance F4BM220 laminate. This PCB is engineered for microwave, RF, and radar systems, offering exceptional electrical properties, low loss, and dimensional stability. Below, we provide a detailed breakdown of its construction, features, and applications.

 

F4BM220 DK2.2 PCB 2-layer 0.5mm Thick with Immersion Gold 35um copper weight using in Microwave, RF, and radar systems 0

 

PCB Construction Details

Parameter Specification
Base Material F4BM220
Layer Count 2-layer (double-sided)
Board Dimensions 51mm x 67mm ± 0.15mm
Minimum Trace/Space 5/8 mils
Minimum Hole Size 0.3mm
Blind/Buried Vias None
Finished Board Thickness 0.6mm
Copper Weight 1oz (1.4 mils) outer layers
Via Plating Thickness 20μm
Surface Finish Immersion Gold
Top Solder Mask None
Bottom Solder Mask None
Top Silkscreen None
Bottom Silkscreen None
Electrical Testing 100% tested prior to shipment
Quality Standard IPC-Class-2

 

 

PCB Stackup

Layer Material Thickness
Copper Layer 1 Copper Foil 35μm
Core Material F4BM220 Core 0.5mm
Copper Layer 2 Copper Foil 35μm

 

 

PCB Statistics

This PCB is optimized for small-scale, high-performance designs with the following specifications:

Parameter Value
Components 5
Total Pads 19
Thru Hole Pads 11
Top SMT Pads 8
Bottom SMT Pads 0
Vias 17
Nets 2
Supplied Artwork Gerber RS-274-X

 

 

About F4BM220 Material

The F4BM220 laminate, developed by Wangling, is a high-performance material made from fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film. It is designed for microwave and RF applications requiring low dielectric loss, high insulation resistance, and excellent stability.

 

Key Features of F4BM220:

  • Dielectric Constant (Dk): 2.2 ± 0.04 at 10GHz.
  • Dissipation Factor (Df): 0.001 at 10GHz, ensuring minimal signal loss.
  • Thermal Coefficient of Dk: -142 ppm/°C (from -55°C to 150°C).
  • Coefficient of Thermal Expansion (CTE): X-axis: 25 ppm/°C. Y-axis: 34 ppm/°C. Z-axis: 240 ppm/°C.
  • Moisture Absorption: ≤ 0.08%.
  • Flammability: UL-94 V0 rated.

The F4BM220 material offers excellent dimensional stability by balancing the ratio of PTFE and fiberglass cloth, resulting in precise control of the dielectric constant and reduced thermal expansion.

 

 

Applications

Microwave and RF Systems

Phase-Sensitive Antennas and Arrays

Power Dividers, Couplers, and Combiners

Base Station Antennas

Satellite Communications

 

 

Conclusion

The double-sided PCB with F4BM220 core is a high-performance, cost-effective solution for microwave, RF, and radar systems. With its low dielectric loss, dimensional stability, and excellent thermal properties, this PCB delivers exceptional performance for high-frequency applications in industries such as telecommunications, aerospace, and defense.

 

Contact us today to learn more or to place an order. We are committed to providing high-quality PCBs that meet your specific requirements!

 

Les étiquettes: 

carte PCB à grande vitesse,

conception de circuit à haute fréquence,

bluetooth circuit board

Shenzhen Bicheng Electronics Technology Co., Ltd
ville de 6-11C Shidai Jingyuan Fuyong, secteur de Baoan, ville de Shenzhen, province du Guangdong, Chine
Téléphone: 86-755-27374847
Plan du site |  Politique de confidentialité | La Chine est bonne. Qualité PCB nouvellement expédiée par Bicheng Le fournisseur. 2016-2025 Shenzhen Bicheng Electronics Technology Co., Ltd Tout le monde. Les droits sont réservés.