| Nombre De Pièces: | 1 pièces |
| Prix: | 0.99-99USD/PCS |
| Emballage Standard: | Emballage |
| Période De Livraison: | 2-10 jours ouvrables |
| Méthode De Paiement: | T/T, Paypal |
| Capacité D'approvisionnement: | 50000 pièces |
Quick Answer
What is ISOLA 370HR?
It's a high-performance, 180°C Tg multifunctional epoxy FR-4 system reinforced with E-glass fabric, designed for multilayer PCB applications demanding maximum thermal reliability. With a decomposition temperature (Td) of 340°C, T260 > 60 minutes, and T288 > 30 minutes, 370HR delivers exceptional thermal stability while maintaining standard FR-4 processability — making it a top choice for sequential lamination designs, aerospace, automotive, and industrial electronics.
What PCB can you build with it?
We offer a complete 6-layer multilayer PCB solution based on ISOLA 370HR, featuring 1.6mm finished thickness, 1 oz copper, ENIG finish, green solder mask with white silkscreen, 50Ω impedance-controlled traces, and IPC Class 3 reliability — ideal for high-reliability applications where thermal performance and signal integrity are critical.
![]()
1. Material Overview
The ISOLA 370HR is a high-performance 180°C glass transition temperature (Tg) FR-4 epoxy system engineered for multilayer printed wiring board (PWB) applications requiring maximum thermal performance and long-term reliability. Manufactured with a unique multifunctional epoxy resin and reinforced with electrical-grade (E-glass) glass fabric, 370HR delivers:
Superior thermal performance vs. traditional FR-4
Low Z-axis expansion for enhanced plated through-hole (PTH) reliability
Mechanical, chemical, and moisture resistance that equal or exceed standard FR-4
Full FR-4 processability – no special processing equipment required
Laser fluorescing and UV blocking for seamless compatibility with AOI systems, optical positioning systems, and photoimageable solder mask imaging
The 370HR system is recognized as best-in-class for sequential lamination designs, making it the material of choice for complex, high-layer-count boards with blind/buried vias.
2. ISOLA 370HR Technical Data Sheet
| Property | Typical Value | Specification Limit | Units | Test Method (IPC-TM-650 or as noted) |
| Glass Transition Temperature (Tg) by DSC | 180 | 170 | °C | 2.4.25 |
| Decomposition Temperature (Td) @ 5% wt loss | 340 | — | °C | ASTM D3850 |
| T260 | > 60 | — | Minutes | ASTM D3850 |
| T288 | > 30 | — | Minutes | ASTM D3850 |
| CTE, Z-axis (Pre-Tg) | 45 | AABUS | ppm/°C | 2.4.24 |
| CTE, Z-axis (Post-Tg) | 230 | — | ppm/°C | 2.4.24 |
| CTE, X-axis (Pre-Tg / Post-Tg) | 13 / 14 | AABUS | ppm/°C | 2.4.24 |
| CTE, Y-axis (Pre-Tg / Post-Tg) | 14 / 17 | — | ppm/°C | 2.4.24 |
| Z-axis Expansion (50-260°C) | 2.8 | — | % | 2.4.24 |
| Thermal Conductivity | 0.4 | — | W/mK | ASTM D5930 |
| Thermal Stress (288°C, 10s) | Pass | Pass Visual | Rating | 2.4.13.1 |
| Dk (Permittivity) @ 100 MHz | 4.24 | 5.4 | — | 2.5.5.3 |
| Dk @ 1 GHz | 4.17 | — | — | 2.5.5.9 |
| Dk @ 2 GHz | 4.04 | — | — | 2.5.5.5 |
| Dk @ 5 GHz | 3.92 | — | — | 2.5.5.5 |
| Dk @ 10 GHz | 3.92 | — | — | 2.5.5.5 |
| Df (Loss Tangent) @ 100 MHz | 0.015 | 0.035 | — | 2.5.5.3 |
| Df @ 1 GHz | 0.0161 | — | — | 2.5.5.9 |
| Df @ 2 GHz | 0.021 | — | — | 2.5.5.5 |
| Df @ 5 GHz | 0.025 | — | — | 2.5.5.5 |
| Df @ 10 GHz | 0.025 | — | — | 2.5.5.5 |
| Volume Resistivity (96/35/90) | — | 1.0×10⁶ | MΩ-cm | 2.5.17.1 |
| Volume Resistivity (After moisture) | 3.0×10⁸ | — | MΩ-cm | 2.5.17.1 |
| Volume Resistivity (Elevated temp) | 7.0×10⁸ | 1.0×10³ | MΩ-cm | 2.5.17.1 |
| Surface Resistivity (96/35/90) | — | 1.0×10⁴ | MΩ | 2.5.17.1 |
| Surface Resistivity (After moisture) | 3.0×10⁶ | — | MΩ | 2.5.17.1 |
| Surface Resistivity (Elevated temp) | 2.0×10⁸ | 1.0×10³ | MΩ | 2.5.17.1 |
| Dielectric Breakdown | > 50 | — | kV | 2.5.6 |
| Arc Resistance | 115 | 60 | Seconds | 2.5.1 |
| Electric Strength | 54 (1350) | 30 (750) | kV/mm (V/mil) | 2.5.6.2 |
| Comparative Tracking Index (CTI) | 3 (175-249) | — | Class (Volts) | UL-746A / ASTM D3638 |
| Peel Strength (Low profile Cu) | 1.14 (6.5) | 0.70 (4.0) | N/mm (lb/in) | 2.4.8 |
| Peel Strength (Standard Cu) | 1.25 (7.0) | 0.80 (4.5) | N/mm (lb/in) | 2.4.8.2 |
| Flexural Strength (Lengthwise) | 90,000 | — | lb/in² | 2.4.4 |
| Flexural Strength (Crosswise) | 77,000 | — | lb/in² | 2.4.4 |
| Tensile Strength (Lengthwise) | 55,900 | — | lb/in² | — |
| Tensile Strength (Crosswise) | 35,620 | — | lb/in² | — |
| Young's Modulus (Grain direction) | 3744 | — | ksi | — |
| Young's Modulus (Fill direction) | 3178 | — | ksi | — |
| Poisson's Ratio (Grain / Fill) | 0.177 / 0.171 | — | — | — |
| Moisture Absorption | 0.15 | — | % | 2.6.2.1 |
| Flammability | V-0 | — | Rating | UL94 |
| Max Operating Temperature (UL) | 130 | — | °C | — |
3. Application Fields
ISOLA 370HR is trusted across high-reliability industries where thermal performance and long-term durability are paramount:
Networking and Communications: High-speed routers, switches, and base station equipment.
Aerospace and Defense: Radar, avionics, and satellite systems.
Medical Electronics: Imaging devices and diagnostic equipment.
Automotive Electronics: Advanced driver-assistance systems (ADAS) and infotainment systems.
![]()
4. Custom Multilayer PCB – Complete Specification
Based on ISOLA 370HR, we offer a complete 6-layer PCB solution with the following specifications:
Stack-Up Configuration
![]()
Board Specifications
| Specification | Detail |
| Board Type | 6-Layer Multilayer PCB |
| Base Material | ISOLA 370HR Laminate & Prepreg |
| Finished Board Thickness | 1.6 mm |
| Finished Copper Weight | 1 oz (35 µm) per layer |
| Board Dimensions | 111 × 78 mm (1 piece) |
| Solder Mask (Top & Bottom) | Green solder mask |
| Silkscreen (Top & Bottom) | White nomenclature/silkscreen |
| Surface Finish | ENIG (Electroless Nickel / Immersion Gold), 2 µ" Gold thickness |
| Hole Wall Copper | 25 µm minimum |
| IPC Classification | Class 3 (High Reliability) |
| Impedance Control | 50Ω on top-layer traces (11 mil trace width) |
| Special Features | Blind vias, Sequential lamination capability |
Top-Layer Impedance Detail
![]()
FAQ
Q1: What makes ISOLA 370HR different from standard FR-4?
A: 370HR offers significantly higher thermal performance. Key differences include:
Tg 180°C vs. ~135°C for standard FR-4 — better lead-free soldering compatibility
Td 340°C — higher decomposition resistance
T260 > 60 min / T288 > 30 min — exceptional thermal stress resistance for sequential lamination
Lower Z-axis expansion (2.8%) — better PTH reliability
AOI/UV compatibility — supports automated optical inspection
Yet it maintains standard FR-4 processability, so no special equipment is required.
Q2: What is the significance of T260 and T288?
A: T260 and T288 measure how many minutes a material can withstand 260°C and 288°C respectively before delaminating or failing.
370HR T260 > 60 minutes — exceptional stability at lead-free soldering temperatures
370HR T288 > 30 minutes — outstanding resistance to rework/high-temperature excursions
These values are critical for sequential lamination, where the board undergoes multiple high-temperature press cycles.
Q3: Can ISOLA 370HR support sequential lamination with blind vias?
A: Yes. In fact, 370HR is recognized as best-in-class for sequential lamination designs. Its high thermal stability (Tg 180°C, Td 340°C, T288 > 30 min) ensures reliable interlayer bonding and PTH integrity across multiple lamination cycles. The 6-layer PCB example described above can incorporate blind vias using this material.
Q4: Is 370HR suitable for impedance-controlled designs?
A: Absolutely. With stable Dk values ranging from 4.24 @ 100 MHz to 3.92 @ 10 GHz, 370HR provides consistent dielectric performance across frequency. The 50Ω impedance-controlled top-layer traces on a 1.6mm board with 11 mil trace width demonstrate this capability. We can design and manufacture to your specific impedance requirements.
Q5: What surface finishes are compatible with 370HR?
A: 370HR is compatible with all standard PCB surface finishes, including:
Our example uses ENIG with 2 µ" gold thickness for excellent solderability and flatness.
Q6: Is ISOLA 370HR RoHS-compliant?
A: Yes. 370HR is RoHS-compliant and halogen-free compatible (check with Isola for specific halogen-free grades). It also meets UL94 V-0 flame-rating requirements.
Q7: What is the maximum operating temperature for 370HR?
A: The UL maximum operating temperature is rated at 130°C. However, the material can withstand higher peak temperatures during soldering and rework (up to 288°C for short durations), as demonstrated by its T288 > 30 minute rating.
Q8: Can you produce IPC Class 3 boards with 370HR?
A: Yes. Our 6-layer 370HR board example is specified to IPC Class 3 — the highest reliability class for aerospace, medical, defense, and automotive applications. This includes 25 µm minimum hole wall copper and rigorous inspection/testing standards.
Q9: What is the typical lead time for custom 370HR PCBs?
A: Lead times vary based on complexity and quantity. For 6-layer boards like the example described, typical lead times range from 10 to 18 working days. Please contact us for specific project timelines.
Ready to Get Started?
Whether you need ISOLA 370HR raw laminate/prepreg, a fully fabricated multilayer PCB with impedance control, or a complex sequential lamination design, we are here to help.
Contact us today for:
Material sampling and testing
Custom stack-up design assistance
Impedance calculation and design support
PCB quoting and DFM revie
Technical support for your specific application
![]()
| Nombre De Pièces: | 1 pièces |
| Prix: | 0.99-99USD/PCS |
| Emballage Standard: | Emballage |
| Période De Livraison: | 2-10 jours ouvrables |
| Méthode De Paiement: | T/T, Paypal |
| Capacité D'approvisionnement: | 50000 pièces |
Quick Answer
What is ISOLA 370HR?
It's a high-performance, 180°C Tg multifunctional epoxy FR-4 system reinforced with E-glass fabric, designed for multilayer PCB applications demanding maximum thermal reliability. With a decomposition temperature (Td) of 340°C, T260 > 60 minutes, and T288 > 30 minutes, 370HR delivers exceptional thermal stability while maintaining standard FR-4 processability — making it a top choice for sequential lamination designs, aerospace, automotive, and industrial electronics.
What PCB can you build with it?
We offer a complete 6-layer multilayer PCB solution based on ISOLA 370HR, featuring 1.6mm finished thickness, 1 oz copper, ENIG finish, green solder mask with white silkscreen, 50Ω impedance-controlled traces, and IPC Class 3 reliability — ideal for high-reliability applications where thermal performance and signal integrity are critical.
![]()
1. Material Overview
The ISOLA 370HR is a high-performance 180°C glass transition temperature (Tg) FR-4 epoxy system engineered for multilayer printed wiring board (PWB) applications requiring maximum thermal performance and long-term reliability. Manufactured with a unique multifunctional epoxy resin and reinforced with electrical-grade (E-glass) glass fabric, 370HR delivers:
Superior thermal performance vs. traditional FR-4
Low Z-axis expansion for enhanced plated through-hole (PTH) reliability
Mechanical, chemical, and moisture resistance that equal or exceed standard FR-4
Full FR-4 processability – no special processing equipment required
Laser fluorescing and UV blocking for seamless compatibility with AOI systems, optical positioning systems, and photoimageable solder mask imaging
The 370HR system is recognized as best-in-class for sequential lamination designs, making it the material of choice for complex, high-layer-count boards with blind/buried vias.
2. ISOLA 370HR Technical Data Sheet
| Property | Typical Value | Specification Limit | Units | Test Method (IPC-TM-650 or as noted) |
| Glass Transition Temperature (Tg) by DSC | 180 | 170 | °C | 2.4.25 |
| Decomposition Temperature (Td) @ 5% wt loss | 340 | — | °C | ASTM D3850 |
| T260 | > 60 | — | Minutes | ASTM D3850 |
| T288 | > 30 | — | Minutes | ASTM D3850 |
| CTE, Z-axis (Pre-Tg) | 45 | AABUS | ppm/°C | 2.4.24 |
| CTE, Z-axis (Post-Tg) | 230 | — | ppm/°C | 2.4.24 |
| CTE, X-axis (Pre-Tg / Post-Tg) | 13 / 14 | AABUS | ppm/°C | 2.4.24 |
| CTE, Y-axis (Pre-Tg / Post-Tg) | 14 / 17 | — | ppm/°C | 2.4.24 |
| Z-axis Expansion (50-260°C) | 2.8 | — | % | 2.4.24 |
| Thermal Conductivity | 0.4 | — | W/mK | ASTM D5930 |
| Thermal Stress (288°C, 10s) | Pass | Pass Visual | Rating | 2.4.13.1 |
| Dk (Permittivity) @ 100 MHz | 4.24 | 5.4 | — | 2.5.5.3 |
| Dk @ 1 GHz | 4.17 | — | — | 2.5.5.9 |
| Dk @ 2 GHz | 4.04 | — | — | 2.5.5.5 |
| Dk @ 5 GHz | 3.92 | — | — | 2.5.5.5 |
| Dk @ 10 GHz | 3.92 | — | — | 2.5.5.5 |
| Df (Loss Tangent) @ 100 MHz | 0.015 | 0.035 | — | 2.5.5.3 |
| Df @ 1 GHz | 0.0161 | — | — | 2.5.5.9 |
| Df @ 2 GHz | 0.021 | — | — | 2.5.5.5 |
| Df @ 5 GHz | 0.025 | — | — | 2.5.5.5 |
| Df @ 10 GHz | 0.025 | — | — | 2.5.5.5 |
| Volume Resistivity (96/35/90) | — | 1.0×10⁶ | MΩ-cm | 2.5.17.1 |
| Volume Resistivity (After moisture) | 3.0×10⁸ | — | MΩ-cm | 2.5.17.1 |
| Volume Resistivity (Elevated temp) | 7.0×10⁸ | 1.0×10³ | MΩ-cm | 2.5.17.1 |
| Surface Resistivity (96/35/90) | — | 1.0×10⁴ | MΩ | 2.5.17.1 |
| Surface Resistivity (After moisture) | 3.0×10⁶ | — | MΩ | 2.5.17.1 |
| Surface Resistivity (Elevated temp) | 2.0×10⁸ | 1.0×10³ | MΩ | 2.5.17.1 |
| Dielectric Breakdown | > 50 | — | kV | 2.5.6 |
| Arc Resistance | 115 | 60 | Seconds | 2.5.1 |
| Electric Strength | 54 (1350) | 30 (750) | kV/mm (V/mil) | 2.5.6.2 |
| Comparative Tracking Index (CTI) | 3 (175-249) | — | Class (Volts) | UL-746A / ASTM D3638 |
| Peel Strength (Low profile Cu) | 1.14 (6.5) | 0.70 (4.0) | N/mm (lb/in) | 2.4.8 |
| Peel Strength (Standard Cu) | 1.25 (7.0) | 0.80 (4.5) | N/mm (lb/in) | 2.4.8.2 |
| Flexural Strength (Lengthwise) | 90,000 | — | lb/in² | 2.4.4 |
| Flexural Strength (Crosswise) | 77,000 | — | lb/in² | 2.4.4 |
| Tensile Strength (Lengthwise) | 55,900 | — | lb/in² | — |
| Tensile Strength (Crosswise) | 35,620 | — | lb/in² | — |
| Young's Modulus (Grain direction) | 3744 | — | ksi | — |
| Young's Modulus (Fill direction) | 3178 | — | ksi | — |
| Poisson's Ratio (Grain / Fill) | 0.177 / 0.171 | — | — | — |
| Moisture Absorption | 0.15 | — | % | 2.6.2.1 |
| Flammability | V-0 | — | Rating | UL94 |
| Max Operating Temperature (UL) | 130 | — | °C | — |
3. Application Fields
ISOLA 370HR is trusted across high-reliability industries where thermal performance and long-term durability are paramount:
Networking and Communications: High-speed routers, switches, and base station equipment.
Aerospace and Defense: Radar, avionics, and satellite systems.
Medical Electronics: Imaging devices and diagnostic equipment.
Automotive Electronics: Advanced driver-assistance systems (ADAS) and infotainment systems.
![]()
4. Custom Multilayer PCB – Complete Specification
Based on ISOLA 370HR, we offer a complete 6-layer PCB solution with the following specifications:
Stack-Up Configuration
![]()
Board Specifications
| Specification | Detail |
| Board Type | 6-Layer Multilayer PCB |
| Base Material | ISOLA 370HR Laminate & Prepreg |
| Finished Board Thickness | 1.6 mm |
| Finished Copper Weight | 1 oz (35 µm) per layer |
| Board Dimensions | 111 × 78 mm (1 piece) |
| Solder Mask (Top & Bottom) | Green solder mask |
| Silkscreen (Top & Bottom) | White nomenclature/silkscreen |
| Surface Finish | ENIG (Electroless Nickel / Immersion Gold), 2 µ" Gold thickness |
| Hole Wall Copper | 25 µm minimum |
| IPC Classification | Class 3 (High Reliability) |
| Impedance Control | 50Ω on top-layer traces (11 mil trace width) |
| Special Features | Blind vias, Sequential lamination capability |
Top-Layer Impedance Detail
![]()
FAQ
Q1: What makes ISOLA 370HR different from standard FR-4?
A: 370HR offers significantly higher thermal performance. Key differences include:
Tg 180°C vs. ~135°C for standard FR-4 — better lead-free soldering compatibility
Td 340°C — higher decomposition resistance
T260 > 60 min / T288 > 30 min — exceptional thermal stress resistance for sequential lamination
Lower Z-axis expansion (2.8%) — better PTH reliability
AOI/UV compatibility — supports automated optical inspection
Yet it maintains standard FR-4 processability, so no special equipment is required.
Q2: What is the significance of T260 and T288?
A: T260 and T288 measure how many minutes a material can withstand 260°C and 288°C respectively before delaminating or failing.
370HR T260 > 60 minutes — exceptional stability at lead-free soldering temperatures
370HR T288 > 30 minutes — outstanding resistance to rework/high-temperature excursions
These values are critical for sequential lamination, where the board undergoes multiple high-temperature press cycles.
Q3: Can ISOLA 370HR support sequential lamination with blind vias?
A: Yes. In fact, 370HR is recognized as best-in-class for sequential lamination designs. Its high thermal stability (Tg 180°C, Td 340°C, T288 > 30 min) ensures reliable interlayer bonding and PTH integrity across multiple lamination cycles. The 6-layer PCB example described above can incorporate blind vias using this material.
Q4: Is 370HR suitable for impedance-controlled designs?
A: Absolutely. With stable Dk values ranging from 4.24 @ 100 MHz to 3.92 @ 10 GHz, 370HR provides consistent dielectric performance across frequency. The 50Ω impedance-controlled top-layer traces on a 1.6mm board with 11 mil trace width demonstrate this capability. We can design and manufacture to your specific impedance requirements.
Q5: What surface finishes are compatible with 370HR?
A: 370HR is compatible with all standard PCB surface finishes, including:
Our example uses ENIG with 2 µ" gold thickness for excellent solderability and flatness.
Q6: Is ISOLA 370HR RoHS-compliant?
A: Yes. 370HR is RoHS-compliant and halogen-free compatible (check with Isola for specific halogen-free grades). It also meets UL94 V-0 flame-rating requirements.
Q7: What is the maximum operating temperature for 370HR?
A: The UL maximum operating temperature is rated at 130°C. However, the material can withstand higher peak temperatures during soldering and rework (up to 288°C for short durations), as demonstrated by its T288 > 30 minute rating.
Q8: Can you produce IPC Class 3 boards with 370HR?
A: Yes. Our 6-layer 370HR board example is specified to IPC Class 3 — the highest reliability class for aerospace, medical, defense, and automotive applications. This includes 25 µm minimum hole wall copper and rigorous inspection/testing standards.
Q9: What is the typical lead time for custom 370HR PCBs?
A: Lead times vary based on complexity and quantity. For 6-layer boards like the example described, typical lead times range from 10 to 18 working days. Please contact us for specific project timelines.
Ready to Get Started?
Whether you need ISOLA 370HR raw laminate/prepreg, a fully fabricated multilayer PCB with impedance control, or a complex sequential lamination design, we are here to help.
Contact us today for:
Material sampling and testing
Custom stack-up design assistance
Impedance calculation and design support
PCB quoting and DFM revie
Technical support for your specific application
![]()