Description de produit
What is TLX-8?
It is a high-volume, fiberglass-reinforced PTFE microwave substrate manufactured by AGC. It has a dielectric constant (Dk) of 2.55 ±0.04 at 10 GHz. The dissipation factor (Df) is 0.0018 at 10 GHz. It offers excellent PIM performance (measured at less than -160 dBc). The material is dimensionally stable. It has very low moisture absorption (0.02%). It is UL94 V-0 rated. It is suitable for low layer count microwave designs. It is ideal for applications that require mechanical reinforcement in severe environments, including space, aerospace, and defense applications.
What PCB can be built with it?
A complete 2-layer RF PCB solution can be provided. The board is based on TLX-8 material. The finished thickness is 0.85 mm. The copper weight is 1 oz per layer. Pure gold plating is applied as the surface finish. No solder mask is applied on either side. White silkscreen is printed on the top layer. The minimum trace and space are 5 and 7 mils. The minimum hole size is 0.3 mm. Via plating thickness is 20 µm. The quality standard is IPC Class 2. This board is ideal for antennas, radar systems, mobile communications, and microwave test equipment.
1. Material Overview
TLX-8 is a PTFE fiberglass laminate. It is manufactured by AGC (formerly Taconic). It is a high-volume antenna material. It offers reliability in a wide range of RF applications. The material is versatile. It is available in a wide range of thicknesses and copper cladding options. It is suitable for low layer count microwave designs.
The material offers mechanical reinforcement. This is important wherever a substrate experiences severe environments.
Examples include:
Resistance to creep for PWBs bolted to a housing that encounters high levels of vibration during space launch
High temperature exposure in engine modules
Radiation resistance in space (NASA-listed for low outgassing)
Resistance to extreme environments at sea for warship antennas
Resistance to a wide temperature range for altimeter substrates during flight
TLX-8 has a long space heritage. It is used wherever woven fiberglass reinforcement is required.
Key Features of TLX-8:
PTFE Fiberglass Laminate — The material combines PTFE with woven fiberglass reinforcement. This provides excellent mechanical strength and dimensional stability.
Low and Stable Dk — The Dk is 2.55 ±0.04 at 10 GHz. The Dk variation is approximately ±2% from -55°C to 125°C.
Low Dissipation Factor — The Df is 0.0018 at 10 GHz. Signal loss is minimized.
Excellent PIM Performance — PIM is measured at less than -160 dBc. This is critical for base station antennas and low-distortion RF systems.
Excellent Thermal Stability — The decomposition temperature (Td) is 535°C (2% weight loss). The Td is 553°C (5% weight loss).
Dimensional Stability — The material is dimensionally stable. After bake, MD is 0.06 mm/m and CD is 0.08 mm/m.
Low Outgassing — The material is NASA-listed for low outgassing. TML is 0.03%. CVCM is 0.00%. WVR is 0.01%.
Low Moisture Absorption — Moisture absorption is only 0.02%. Stable performance in humid environments is ensured.
2. TLX-8 Technical Data Sheet
| Property |
Typical Value |
Units |
Condition |
Test Method |
| Dielectric Constant |
2.55 ±0.04 |
— |
@ 10 GHz |
IPC-650 2.5.5.3 |
| Dissipation Factor |
0.0018 |
— |
@ 10 GHz |
IPC-650 2.5.5.5.1 |
| PIM Performance |
< -160 |
dBc |
20 W per channel @ 800/1800 MHz |
PCB coupon measurement |
| Outgassing (TML) |
0.03 |
% |
4 H 257°F @ ≤5×10⁻⁵ Torr |
ASTM E 595 |
| Outgassing (CVCM) |
0 |
% |
4 H 257°F @ ≤5×10⁻⁵ Torr |
ASTM E 595 |
| Outgassing (WVR) |
0.01 |
% |
4 H 257°F @ ≤5×10⁻⁵ Torr |
ASTM E 595 |
| Surface Resistivity (Elevated Temp.) |
6.605 × 10⁸ |
Mohm |
— |
IPC-650 2.5.17.1 Sec. 5.2.1 |
| Surface Resistivity (Humidity Cond.) |
3.550 × 10⁶ |
Mohm |
— |
IPC-650 2.5.17.1 Sec. 5.2.1 |
| Volume Resistivity (Elevated Temp.) |
1.110 × 10¹⁰ |
Mohm/cm |
— |
IPC-650 2.5.17.1 Sec. 5.2.1 |
| Volume Resistivity (Humidity Cond.) |
1.046 × 10¹⁰ |
Mohm/cm |
— |
IPC-650 2.5.17.1 Sec. 5.2.1 |
| Dimensional Stability (MD – After Bake) |
0.06 |
mm/m |
— |
IPC-650 2.4.39 Sec. 5.4 |
| Dimensional Stability (CD – After Bake) |
0.08 |
mm/m |
— |
IPC-650 2.4.39 Sec. 5.4 |
| Dimensional Stability (MD – Thermal Stress) |
0.09 |
mm/m |
— |
IPC-650 2.4.39 Sec. 5.5 |
| Dimensional Stability (CD – Thermal Stress) |
0.1 |
mm/m |
— |
IPC-650 2.4.39 Sec. 5.5 |
| Thermal Conductivity |
0.19 |
W/m·K |
— |
ASTM F433 / ASTM 1530-06 |
| CTE X-axis |
21 |
ppm/°C |
25-260°C |
IPC-650 2.4.41 / ASTM D 3386 |
| CTE Y-axis |
23 |
ppm/°C |
25-260°C |
IPC-650 2.4.41 / ASTM D 3386 |
| CTE Z-axis |
215 |
ppm/°C |
25-260°C |
IPC-650 2.4.41 / ASTM D 3386 |
| Td (2% Weight Loss) |
535 |
°C |
— |
IPC-650 2.4.24.6 (TGA) |
| Td (5% Weight Loss) |
553 |
°C |
— |
IPC-650 2.4.24.6 (TGA) |
| Peel Strength (1 oz ED) |
2.63 (15) |
N/mm (lbs/in) |
Thermal stress |
IPC-650 2.4.8 Sec. 5.2.2 |
| Peel Strength (1 oz RTF) |
2.98 (17) |
N/mm² (kpsi) |
— |
IPC-650 2.4.8 Sec. 5.2.2 |
| Peel Strength (½ oz ED) |
2.45 (14) |
N/mm² (kpsi) |
Elevated temp. |
IPC-650 2.4.8.3 |
| Young's Modulus (MD) |
6,757 (980) |
N/mm² (psi) |
— |
ASTM D 902 |
| Young's Modulus (CD) |
8,274 (1,200) |
N/mm² (psi) |
— |
ASTM D 902 |
| Moisture Absorption |
0.02 |
% |
— |
IPC-650 2.6.2.1 |
| Dielectric Breakdown |
>45 |
kV |
— |
IPC-650 2.5.6 |
| Flammability Rating |
V-0 |
— |
— |
UL-94 |
3. Key Advantages of TLX-8
|
Feature
|
Benefit
|
|
Dk is 2.55 ±0.04
|
Tight tolerance allows consistent impedance control
|
|
Df is 0.0018 at 10 GHz
|
Low loss minimizes signal attenuation in microwave circuits
|
|
PIM is < -160 dBc
|
Excellent low-distortion performance for base station antennas
|
|
Td is > 535°C
|
Exceptional thermal decomposition resistance is provided
|
|
CTE X/Y is 21/23 ppm/°C
|
Good dimensional stability is achieved
|
|
Low outgassing (TML 0.03%)
|
NASA-listed for space applications
|
|
Moisture absorption is 0.02%
|
Very low water absorption ensures stable performance in humid environments
|
|
UL94 V-0 rating is achieved
|
Fire safety compliance is ensured
|
|
Wide thickness range (0.064-6.35 mm)
|
Design flexibility is enabled
|
|
High-volume production is supported
|
Cost-effective antenna material
|
4. Application Fields
TLX-8 is used in many demanding RF and microwave applications:
- radar systems
- mobile communications
- microwave test equipment
- microwave transmission devices
- couplers, splitters, combiners, amplifiers, antennas
5. Custom 2-Layer RF PCB – Complete Specification
A complete 2-layer RF PCB solution can be provided based on TLX-8. The specifications are shown below.
Board Specifications
| Specification |
Detail |
| Board Type |
2-Layer RF PCB |
| Base Material |
TLX-8 (0.762 mm / 30 mil core) |
| Finished Board Thickness |
0.85 mm |
| Finished Copper Weight |
1 oz (35 µm) per layer |
| Board Dimensions |
76.4 × 98.6 mm (1 piece) |
| Dimension Tolerance |
±0.15 mm |
| Minimum Trace / Space |
5 / 7 mils |
| Minimum Hole Size |
0.3 mm |
| Via Plating Thickness |
20 µm |
| Surface Finish |
Pure Gold Plating |
| Top Solder Mask |
No |
| Bottom Solder Mask |
No |
| Top Silkscreen |
White |
| Bottom Silkscreen |
No |
| IPC Classification |
Class 2 |
| Artwork Format |
Gerber RS-274-X |
| Testing |
100% Electrical Test (before shipment) |
| Availability |
Worldwide |
6. Why Pure Gold Finish Is Used
Pure gold plating is chosen for this RF PCB. The advantages are listed below.
| Advantage |
Benefit |
| Excellent solderability is provided |
An oxidation-free surface is available for component attachment |
| Wire bonding is supported |
RF components that require gold wire bonding can be used |
| Corrosion resistance is provided |
Copper traces are protected in harsh environments |
| Low contact resistance is achieved |
This is suitable for edge connectors and test points |
| Long shelf life is maintained |
Solderability is preserved over extended periods |
7. Why No Solder Mask Is Used
| Advantage |
Benefit |
| Weight is reduced |
Thin, lightweight boards are achieved |
| Cost is reduced |
Solder mask application is eliminated |
| RF performance is optimized |
Solder mask can affect impedance and introduce loss at high frequencies |
| Bare copper grounding is enabled |
Direct grounding connections can be made |
| Visual inspection is simplified |
Traces and pads are clearly visible |
Q1: What is the dielectric constant of TLX-8?
The process Dk is 2.55 ±0.04 at 10 GHz. The Dk variation is approximately ±2% from -55°C to 125°C. This stable Dk allows consistent impedance control.
Q2: What is the PIM performance of TLX-8?
PIM is measured at less than -160 dBc. This measurement is performed using a manufactured PCB coupon. The test uses 20 watts per channel at 800 and 1800 MHz. This excellent PIM performance makes TLX-8 ideal for base station antennas.
Q3: Is TLX-8 suitable for space applications?
Yes. TLX-8 has a long space heritage. It is NASA-listed for low outgassing. The outgassing values are TML 0.03%, CVCM 0.00%, and WVR 0.01%. It is used in space launch vehicles, satellites, and other space applications.
Q4: What thicknesses are available for TLX-8?
TLX-8 is available in thicknesses from 0.064 mm (0.0025") to 6.35 mm (0.250"). It can be manufactured in increments of 0.005" (0.125 mm). Standard panel sizes include 18" × 24" (457 mm × 610 mm) and other sizes up to 36" × 48".
Q5: Where can the official TLX-8 data sheet be obtained?
The official data sheet is available from AGC (formerly Taconic). The contact email is agc-ml.info-maltimaterial@agc.com. Our team can also provide documentation.
Ready to Get Started?
TLX-8 raw laminate can be provided. Fully fabricated 2-layer RF PCBs with pure gold finish and fine-line capability can be manufactured.
Contact us today for:
Material sampling and testing
RF circuit design assistance
Impedance calculation and design support
PCB quoting and DFM review
Technical support for your specific application
Votre message doit contenir entre 20 et 3 000 caractères!