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Aperçu ProduitsPanneau hybride de carte PCB8-Layer RO4350B + Isola I-Tera® MT40 multilayer Hybrid RF PCB with blind vias (L1–L2, L7–L8) and 50Ω single-ended impedance control withstand multiple SMT reflow soldering cycles
8-Layer RO4350B + Isola I-Tera® MT40 multilayer Hybrid RF PCB with blind vias (L1–L2, L7–L8) and 50Ω single-ended impedance control withstand multiple SMT reflow soldering cycles
8-Layer RO4350B + Isola I-Tera® MT40 multilayer Hybrid RF PCB with blind vias (L1–L2, L7–L8) and 50Ω single-ended impedance control withstand multiple SMT reflow soldering cycles 8-Layer RO4350B + Isola I-Tera® MT40 multilayer Hybrid RF PCB with blind vias (L1–L2, L7–L8) and 50Ω single-ended impedance control withstand multiple SMT reflow soldering cycles 8-Layer RO4350B + Isola I-Tera® MT40 multilayer Hybrid RF PCB with blind vias (L1–L2, L7–L8) and 50Ω single-ended impedance control withstand multiple SMT reflow soldering cycles
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8-Layer RO4350B + Isola I-Tera® MT40 multilayer Hybrid RF PCB with blind vias (L1–L2, L7–L8) and 50Ω single-ended impedance control withstand multiple SMT reflow soldering cycles

Nom de marque: Rogers Numéro de modèle: RO4350B + Isola I-Tera® MT40

Description de produit

This article presents a detailed design strategy for an 8-layer hybrid RF PCB that combines the superior high-frequency performance of Rogers RO4350B™ on the outer layers with the high thermal reliability and cost-effectiveness of Isola I-Tera® MT40 in the inner layers. This hybrid construction is ideal for demanding RF/microwave applications requiring controlled impedance, blind vias, and reliable thermal management in a medium-to-large form factor. By integrating RO4350B as

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